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eDesign
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Download Moldex3D/eDesign Brochure
Moldex3D/eDesign Ensure Your Design
Moldex3D/eDesign
efficiently verifies your part/mold designs through the synergy of
true 3D capabilities, parallel computing technology, and a
user-friendly workflow. Not only will you minimize your design
cycle and time-to-market, but you will maximize your return on
investment – Explore now why Moldex3D/eDesign is your best CAE
Strategy.
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Moldex3D/eDesign Feature
Highlights:
- Pioneering
3D Technology—Reliable Results
- Parallel
Computing—High-speed Calculation
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Intelligence—Cooling & Runner Wizards
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Flexibility—Optimize Your Design
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Teamwork—Enhance Cross-department Collaboration
Pioneering 3D
Technology—Reliable Results
Although inaccurate results can occur with the “2D + thickness” approach
used by others, Moldex3D/eDesign provides reliable results as the first
3D simulation package customized for part/mold design teams. Equipped
with a pioneering 3D kernel and meshing engine, you can be confident
with the results of your design studies using Moldex3D/eDesign.
Parallel Computing—High-speed Calculation
Time-to-market has never being so
critical in global competition. The parallel computing technology of
Moldex3D/eDesign not only dramatically enhances the calculation
performance, but also saves your time -- a reliable 3D analysis can be
done during a coffee break!
Intelligence—Cooling & Runner
Wizards
Easy-to-use solutions are always
appreciated. The intelligence of the Moldex3D/eDesign runner and cooling
wizards helps you be more effective. Now you can easily define runners,
sprues, drops and cold slugs; create an entire feeding/cooling system;
and quickly optimize the design.
Flexibility—Optimize Your
Design
Fed up with the high costs of mold
trials or the incomplete design resulted from unexpected compromise with
manufacturability? Moldex3D/eDesign, as a professional advisory tool
for part/mold design, provides the opportunity to cost-effectively
explore many potential revisions to improve design during any point in
the development cycle.
Teamwork—Enhance
Cross-department Collaboration
From concept generation through
CAD design, tooling and production, the collective intelligence of your
key personnel is enhanced by the seamless communication supported by
Moldex3D/eDesign. The flexible licensing, user-friendly workflow and
approachable interface all make Moldex3D/eDesign a highly-efficient
platform for cross-department collaboration and confident decision
making.
System Requirements :
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Microsoft Windows Vista, Windows XP Professional, Windows XP x64,
Windows Server 2008
* Intel Core i7 Series, Intel Xeon, Intel EM64T, MD Athlon, or AMD
Opteron -based processor
* 8 GB RAM or greater
For more information of Moldex3D
best-in-class 3D technology, please refer to
Solid/Shell.
Moldex3D/eDesign
Modules:
 Moldex3D/eDesign-Flow
Moldex3D-Flow simulates the entire filling process of
injection molding for thermoplastic materials. With the
power of Moldex3D-Flow, you can clearly understand how
the solid melt flow progresses, accurately identify
where solid weld surfaces are, detect short shot
problems, predict air trap location, etc.
The explicit analysis capabilities of Moldex3D/eDesign-Flow
give you deep insight in solid plastic flow behaviors
from macro view to micro view, such as fountain flow,
inertia effect and gravity effect. With the power of
Moldex3D/eDesign-Flow, you can clearly understand how
the solid melt flow progresses, accurately identify
where eDesign weld surfaces are, detect short shot
problems, etc. |
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 Moldex3D/eDesign-Pack
Moldex3D-Pack incorporates material compressibility (PVT
change) in its full 3D Navier-Stokes solver to account
for the density variation and melt flow behaviors in
packing process for thermoplastic materials. Using
Moldex3D-Pack, it can help you to preciously determine
gate freeze time, efficient packing time and proper
packing pressure to minimize areas of high volumetric
shrinkage.
Using Moldex3D/eDesign-Pack, even for thick parts or
parts with big thickness changes, you can also
investigate all factors in packing process from material
choice, gate design, and processing conditions. With
true 3D technology, it can help you to preciously
determine gate freeze time, efficient packing time and
proper packing pressure to minimize areas of high
volumetric shrinkage. |
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 Moldex3D/eDesign-Cool
Moldex3D-Cool is a true 3D simulation tool to analyze
the mold cooling process. Based on true 3D technology,
it is an efficient tool to accurately analyze the mold
temperature, the efficiency of cooling channel layout,
and the required cooling time. Furthermore, advanced
transient cool function supports the simulation of
variotherm process to simulate the results of
deliberately using higher mold temperature during
filling and packing and then dropping the temperature
for the remainder of cycle. |
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 Moldex3D/eDesign-Warp
Moldex3D-Warp provides users a true 3D simulation
tool to anatomize the causes of shrinkage and warpage
and further control these defects before mold is built.
With eDesign-Warp, users can easily and efficiently
improve the part quality and optimize design. For
fiber-filled material, eDesign-Warp incorporates fiber
composite theories and the fiber orientation results
from eDesign-Fiber to predict its anisotropic shrinkage
and warpage. |
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 Moldex3D/eDesign-Fiber
Moldex3D-Fiber accurately simulates the 3D fiber
orientation in mold-filling process and further
calculates the process-induced anisotropic
thermo-mechanical properties of fiber-reinforced plastic
part. With Moldex3D-Fiber, users can understand the 3D
orientation of fiber and further control the anisotropic
shrinkage of fiber-reinforced part. The process-induced
anisotropic shrinkage and mechanical properties due to
fiber orientation are therefore taken into account for
accurate warpage prediction. |
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 Moldex3D/eDesign-MCM
Multi-component molding is one of the greatest
methods to diversify the development of the plastic
molded product fabrication. Moldex3D-MCM simulates the
multiple components molding process, including insert
molding, overmolding and multi-shot sequential molding.
Based on true 3D technology, explicit analysis
capabilities of Moldex3D-MCM give you a powerful tool to
accurately analyze the interaction behavior of different
components and further optimize product design.
Moreover, this module helps you to predict the warpage
due to property mismatch of different materials,
prolonged cooling time and unsymmetrical shrinkage in
two-color or overmolding processes...etc. |
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 Moldex3D/eDesign-RIM
Moldex3D-RIM module is a true 3D simulation tool to
analyze the reactive injection molding process for
thermoset materials. The typical applications include
injection molding of unsaturated polyester,
polyurethane, liquid silicon rubber, epoxy molding
compound, etc. It is capable of simulating cavity
filling and curing, part warpage, fiber orientation,
multi-component process, etc. |
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 Moldex3D/eDesign-I2
Moldex3D-I2 is a series of interface modules to
integrate Moldex3D and famous commerical structural CAE
software, including ABAQUS,
ANSYS, MSC.Nastran, NENastran, LS-Dyna, Marc and DigiMat.
These modules help users to introduce the
process-induced properties, such as fiber orientation or
residual stress, into the above-mentioned software to
allow users to evaluate the impact of the molding
process on the structural performance of the part. |
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 Parallel
computing
Parallel computing is fast becoming an inexpensive
alternative to standard supercomputer for solving large
scale problems that arise in scientific and engineering
applications. Generally, there are two types of parallel
computing platform: (1)Symmetric Multiple Processor, SMP,
and (2) Massively Parallel Processing, MPP. The CPUs of
a SMP platform share the same memory and are controlled
by a single operating system. |
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 Moldex3D-Viscoelasticity
Plastic (Polymeric) fluids are often called
viscoelastic fluids because they have both viscous and
elastic properties. Moldex3D
-Viscoelasticity includes this essential characteristic
to effectively predict the flow-induced residual stress
and prevent the potential design problem. Furthermore,
this stress can also be applied to predict the optical
properties and be taken into account in the warpage
analysis. |
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